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The company has been committed to the development of mixed-signal processes and power IC processes, possessing full-scale wafer manufacturing capabilities across 6-inch, 8-inch, and 12-inch lines. It has constructed a unique process platform system covering: CMOS/Analog, BiCMOS, RF/Mixed-Signal, BCD, HV, e-NVM, and MEMS, along with a series of customized process platforms.
6-inch & 8-inch Roadmaps
| Tech. | BCD | HV CMOS | Mixed-Signal | Logic | e-NVW |
0.13μm/0.11μm | |||||
0.18μm/0.153μm | |||||
0.25μm | |||||
0.35μm | |||||
0.5μm | |||||
>0.5μm | |||||
>1.0μm | |||||
MEMS | Pressure sensor、Silicon Microphone、Photoelectric sensors、Accelerometer、Thermopiles sensor、Gas sensor、Micro-mirror、RF Filter、Inkjet Printhead、Microfluidics | ||||
Special Device | APD/ SPAD、Si-Cap(Planar&Trench)、Quartz and Optical Component(PLC&PCR)、Gene Test | ||||
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12-inch Roadmaps
LP | e-NVM | HV | RF | BCD | ULP | |
90T | ||||||
90nm | ||||||
55nm | ||||||
40nm | ||||||
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| Voltage | SGT | LV | SJ | IGBT |
15~30V |
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30~60V | ||||
60~100V | ||||
100~200V |
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200~400V | ||||
400~800V | ||||
800~1200V | ||||
1200~1700V | ||||
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